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40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 60℃

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guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.

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40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 60℃

Name: 40KHz80KHz Semiconductor Silicon Wafer Cleaner Ultrasonic AlkalineAcid Cleaning DI Water Rinsing 60
Brand: Jietai
Price: 800000 USD

Brand Name : Jietai

Model Number : JTM-100504AD

Certification : CE, FCC, ROHS, etc.

Place of Origin : Dongguan, Guangdong

MOQ : 1

Price : ￥800000

Payment Terms : T/T

Supply Ability : One unit. It will take 30 to 60 days.

Delivery Time : 30-60work days

Packaging Details : Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Number of Tanks : 10

Cleaning Frequency : 40KHZ/80KHZ

Type : Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing

Name : Semiconductor Cleaning Machine

Overall Dimensions : 12M*2M*2.8M

Power : 120KW

Cleaning temperature : 60℃

Model : JTM-100504AD

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Product Introduction: Semiconductor Silicon Wafer Cleaning System

Tailored for semiconductor manufacturing workflows, this precision cleaning system integrates multi-stage ultrasonic processes to achieve ultra-high surface purity of silicon wafers, critical for ensuring device yield and performance in IC fabrication and MEMS processing.

Core Cleaning Stages:

Ultrasonic Alkaline Cleaning: Utilizes cavitation effect at adjustable frequencies to dissolve organic residues, photoresist remnants, and particulate contaminants from wafer surfaces and microstructures, preparing substrates for subsequent acid treatment.

Ultrasonic Acid Cleaning: Targets inorganic impurities (e.g., metal ions, oxide layers) via frequency-optimized ultrasonic energy, enhancing chemical reactivity to dislodge submicron contaminants embedded in patterned structures or wafer edges.

DI Water Rinsing: Implements high-purity deionized water circulation to eliminate residual chemicals, ensuring surface neutrality and meeting strict conductivity standards (≤18.2MΩ·cm) required for advanced semiconductor processing.

Technical Parameters:

Ultrasonic Frequency Range: 40KHz-80KHz (multi-band adjustable, enabling precise matching to contamination types and wafer geometries)

Process Temperature: 60℃ (thermostatically controlled to optimize chemical reaction rates while preventing wafer damage)

Material Compatibility: Constructed with PFA-lined tanks and quartz components to resist corrosive chemistries, avoiding secondary contamination.

Key Advantages:

Achieves sub-50nm particle removal efficiency, compliant with SEMI F020 standards

Frequency-tunable ultrasonic modules adapt to bare wafers, patterned wafers, and thin films

Integrated temperature control ensures consistent cleaning efficacy across batch processing

Seamless integration with upstream wafer handling systems and downstream lithography/etching processes

Application: Ideal for pre-diffusion, pre-deposition, and post-etch cleaning in 4-inch to 12-inch silicon wafer manufacturing lines.

Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, DI water rinsing, 40-80KHz, 60℃ process, silicon wafer surface treatment​

40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 60℃

40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI Water Rinsing, 60℃ Images

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